Japan, Jan. 20 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'ADDITIVE FOR CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2024-157715
Category (FI): C08L63/00@C,C08L101/00,C08K5/132,H01L23/30@R,H10W74/47
Stage: Grant (IP right document published.)
Filing Date: Sept. 11, 2024
Publication Date: Dec. 5, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
