Japan, Jan. 16 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'ADHERING METHOD FOR PROTECTIVE SHEET AND PROCESSING METHOD FOR WAFER.' Other related details are as follows:
Application Number: JP,2022-031317
Category (FI): B23D5/02,B24B41/06@Z,H01L21/304,631,H10P52/00@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 1, 2022
Publication Date: Sept. 13, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.