Japan Intellectual Property Rights: ADHESIVE FILM FOR BACK GRINDING AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Japan, March 5 -- RM TOHCELLO CO LTD has got intellectual property rights for 'ADHESIVE FILM FOR BACK GRINDING AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE.' Other related details are as follows:

Application Number: JP,2024-120854

Category (FI): B24B41/06@L,H01L21/304,622@J,H01L21/304,631,H01L21/78@M,H10P52/00@C,H10P52/00@M,H10P54/92,H10P58/00@M

Stage: PROBLEM TO BE SOLVED: To provide an adhesive film for backgrinding capable of reducing adhesive residue on an electronic component when the adhesive film is peeled off from the electronic component after a backgrinding process.SOLUTION: An adhesive film (50) for backgrinding includes a base layer (10) and an ultraviolet-curable adhesive resin layer (20) provided on one side of the base layer (10), and is used to protect the surface of an electronic component (30), and the adhesive resin layer has a breaking elongation of 20% or more and 200% or less after ultraviolet curing.SELECTED DRAWING: Figure 1 (Grant)

Filing Date: July 26, 2024

Publication Date: Oct. 23, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.