Japan, Oct. 15 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'ADHESIVE FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2025-069272
Category (FI): H01L21/60,311@S,H01L23/30@D,C09J201/00,C09J11/04,C09J11/06,H10W74/15,H10W72/00,101@S
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 21, 2025
Publication Date: July 23, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
