Japan Intellectual Property Rights: ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Japan, Oct. 9 -- LINTEC CORP has got intellectual property rights for 'ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-117946

Category (FI): H01L21/304,622@J,H01L21/304,631,H01L21/78@M,H01L21/78@Q,C09J7/38,C09J201/00,C09J199/00,H10P52/00@C,H10P52/00@M,H10P54/20,201,H10P54/30,H10P54/50,H10P58/00@M,H10P58/00@Q

Stage: Grant (IP right granted following substantive examination.)

Filing Date: July 25, 2022

Publication Date: April 6, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.