Japan, June 10 -- APIC YAMADA CORP has got intellectual property rights for 'APPARATUS AND METHOD FOR FORMING SEALING RESIN USED IN COMPRESSION MOLDING.' Other related details are as follows:
Application Number: JP,2023-050308
Category (FI): B29B9/08,B29C43/36,B29C33/12,H10W74/01@R,H01L21/56@R
Stage: Grant (IP right document published.)
Filing Date: March 27, 2023
Publication Date: Oct. 9, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
