Japan, July 14 -- IBIDEN CO LTD has got intellectual property rights for 'AQUEOUS SOLUTION FOR ELECTROPLATING PRETREATMENT.' Other related details are as follows:
Application Number: JP,2022-090275
Category (FI): H05K3/18@G,C25D5/34
Stage: PROBLEM TO BE SOLVED: To provide an aqueous solution for electroplating pretreatment and an electroplating pretreatment method for improving connectivity between a chemical copper substrate and an electroplating copper layer.SOLUTION: An aqueous solution for electroplating pretreatment contains the same pretreatment component as a smoothing treatment component composed of halogen ions and/or a nonionic surfactant in an electroplating solution in a subsequent step. The concentration of the pretreatment component is two times or more higher than the concentration of the smoothing treatment component in the electroplating solution in the subsequent step.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: June 2, 2022
Publication Date: Dec. 14, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
