Japan, April 22 -- NEC CORP has got intellectual property rights for 'BONDING MATERIAL, TEMPORARY FIXING METHOD, AND MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-043454
Category (FI): H05K1/18@U,H05K3/3478,H05K3/34,504@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 18, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
