Japan, Jan. 27 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE.' Other related details are as follows:
Application Number: JP,2023-011194
Category (FI): H01L21/60,301@N,H01L21/88@T,H10W20/49@T,H10W72/59@N
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 27, 2023
Publication Date: Aug. 8, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
