Japan, Jan. 15 -- BONDTECH INC,SUGA TADATOMO has got intellectual property rights for 'BONDING SYSTEM AND BONDING METHOD.' Other related details are as follows:
Application Number: JP,2024-221513
Category (FI): H01L21/02@B,H01L21/52@F,H01L21/60,311@T,H01L21/68@E,H01L21/78@Y,H10W72/00,101@T
Stage: Grant (IP right document published.)
Filing Date: Dec. 18, 2024
Publication Date: March 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
