Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'CHIP MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-019259
Category (FI): H01L21/304,601@Z,H01L21/78@F,H01L21/78@B,H01L21/78@Q,H10P52/00@R,H10P58/00@B,H10P58/00@F,H10P58/00@Q,H10P95/60@Z,H10P52/00@Y
Stage: PROBLEM TO BE SOLVED: To provide a chip manufacturing method with which it is possible to prevent breakage of a device when removing a ring-shaped reinforcement part and improve the productivity of chips manufactured from a wafer.SOLUTION: Prior to a removal step in which a ring-shaped reinforcement part is removed, a singulation step for singulating a plurality of devices and manufacturing chips is carried out. So the removal step is carried out while the ring-shaped reinforcement part and the plurality of device chips are separated, making it possible to prevent the devices from being broken by the force applied to the ring-shaped reinforcement part in the removal step. Furthermore, there is no step of separating the device region of a wafer and the ring-shaped reinforcement part, and it is possible to manufacture a plurality of device chips while at the same time removing the ring-shaped reinforcement part. Thus, as compared with a chip manufacturing method that includes said step, chip productivity can be improved.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: Feb. 10, 2022
Publication Date: Aug. 23, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
