Japan Intellectual Property Rights: CMP POLISHING PAD WITH ENHANCED POLISHING RATE

Japan, Jan. 19 -- ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC has got intellectual property rights for 'CMP POLISHING PAD WITH ENHANCED POLISHING RATE.' Other related details are as follows:

Application Number: JP,2022-049560

Category (FI): B24B37/00@H,B24B37/24@B,B24B37/24@C,B24B37/24@Z,H01L21/304,622@D,H01L21/304,622@F,H10P52/00@D,H10P52/00@H,H10P52/40

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 25, 2022

Publication Date: Oct. 17, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.