Japan, Aug. 18 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN PATTERN WAFER AND METHOD FOR POLISHING TUNGSTEN PATTERN WAFER USING THE SAME.' Other related details are as follows:
Application Number: JP,2022-040260
Category (FI): H10P52/00@H,H10P52/40,B24B37/00@H,C09K3/14,550@Z,H01L21/304,622@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 15, 2022
Publication Date: Oct. 4, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
