Japan Intellectual Property Rights: CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Japan, March 25 -- SEKISUI CHEM CO LTD has got intellectual property rights for 'CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE.' Other related details are as follows:

Application Number: JP,2024-231823

Category (FI): H10W72/00,101@S,H01B5/00@G,H01B1/00@G,B22F1/00@R,H01B1/22@D,H01B5/16,B22F1/17,B22F1/05,H01R11/01,501@C,H01R11/01,501@E,H01R11/01,501@A,H10W72/40,H01B1/00@H,H01B1/00@C,H01B5/00@H,H01B5/00@C,B22F1/10,B22F1/18,B22F1/06,B22F1/14,400,H01L21/60,311@S

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 27, 2024

Publication Date: April 15, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.