Japan, Oct. 7 -- DENSO CORP,MIRISE TECHNOLOGIES CORP,TOYOTA MOTOR CORP has got intellectual property rights for 'CONNECTION STRUCTURE, SEMICONDUCTOR DEVICE, AND INSULATION BUILT-IN BOARD.' Other related details are as follows:
Application Number: JP,2022-174870
Category (FI): H01L23/36@D,H10W40/25,H05K1/02@F,H01L23/36@M,H05K3/38@E,H10W40/60@M
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 31, 2022
Publication Date: May 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
