Japan, Nov. 17 -- LAM RESEARCH CORPORATION has got intellectual property rights for 'CONNECTOR FOR SUBSTRATE SUPPORT WITH EMBEDDED TEMPERATURE SENSORS.' Other related details are as follows:
Application Number: JP,2023-171720
Category (FI): H01L21/302,101@B,H01L21/68@N,H01L21/68@R,H01L21/302,101@G
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 3, 2023
Publication Date: Dec. 26, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
