Japan, June 10 -- AESC DYNAMICS TECHNOLOGY (ORDOS) LTD,AESC DYNAMICS TECHNOLOGY (HUBEI) LTD,AESC DYNAMICS TECHNOLOGY (HEBEI) LTD,AESC INTERLLIGENT INNOVATION DYNAMICS TECHNOLOGY (SHANGHAI) LTD,AESC DYNAMICS TECHNOLOGY (JIANGSU) LTD has got intellectual property rights for 'COVER ASSEMBLY, BATTERY, AND ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2023-213905
Category (FI): H01M50/553,H01M50/566,H01M50/562,H01M50/528,H01M50/176,H01M50/15,H01G11/78,H01G11/74
Stage: Grant (IP right document published.)
Filing Date: Dec. 19, 2023
Publication Date: Jan. 16, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
