Japan, July 9 -- LINE PLAST:KK has got intellectual property rights for 'COVER TAPE FOR PACKAGING CHIP ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2022-067134
Category (FI): B65D85/86,300,B65D77/20@L,B32B27/18@Z,B32B27/00,104
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 14, 2022
Publication Date: Nov. 8, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
