Japan Intellectual Property Rights: Cu-[Ni, Co]-Si SYSTEM COPPER ALLOY PLATE MATERIAL, ENERGIZATION COMPONENT, AND HEAT DISSIPATION COMPONENT

Japan, July 20 -- DOWA METALTECH KK has got intellectual property rights for 'Cu-[Ni, Co]-Si SYSTEM COPPER ALLOY PLATE MATERIAL, ENERGIZATION COMPONENT, AND HEAT DISSIPATION COMPONENT.' Other related details are as follows:

Application Number: JP,2023-162911

Category (FI): C22F1/08@B,C22C9/06,C22C1/02,503@B,C22F1/00,622,C22F1/00,623,C22F1/00,630@A,C22F1/00,630@G,C22F1/00,630@K,C22F1/00,650@F,C22F1/00,661@A,C22F1/00,661@Z,C22F1/00,681,C22F1/00,682,C22F1/00,683,C22F1/00,685@Z,C22F1/00,686@A,C22F1/00,691@B,C22F1/00,691@C,C22F1/00,694@A

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 26, 2023

Publication Date: April 7, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.