Japan, July 14 -- DISCO CORP has got intellectual property rights for 'CUTTING DEVICE.' Other related details are as follows:
Application Number: JP,2022-087428
Category (FI): B24B27/06@M,B24B55/02@D,H10P58/00@F,H10P52/00@C,H01L21/78@F,H01L21/304,631
Stage: PROBLEM TO BE SOLVED: To provide a cutting device that can efficiently prevent chips from adhering to the device.SOLUTION: A cutting device 1 is configured to include: a chuck table 8a for holding a work-piece W; cutting means 9 that rotatably comprises a cutting blade 93 for cutting the work-piece W held on the chuck table 8a; X-axis feeding means that feeds the chuck table 8a and the cutting means 9 relatively in an X-axis direction for cutting; and Y-axis feeding means that indexing-feeds the chuck table 8a and the cutting means 9 relatively in a Y-axis direction which is orthogonal to the X-axis direction. The cutting device comprises: a cutting liquid supply nozzle 95 which is arranged adjacently to the cutting means 9, and supplies cutting liquid L2 to a contact point between the cutting blade 93 and the work-piece W; and a medicinal solution supply nozzle 96 that has a length exceeding a width P1 of the work-piece W in the Y-axis direction, and supplies a medicinal solution L1 for preventing adhesion of chips to a surface Wa of the work-piece W.SELECTED DRAWING: Figure 5 (Grant)
Filing Date: May 30, 2022
Publication Date: Dec. 12, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
