Japan, Feb. 24 -- JAPAN AVIATION ELECTRONICS INDUSTRY LTD has got intellectual property rights for 'DEVICE.' Other related details are as follows:
Application Number: JP,2022-008089
Category (FI): H01L23/02@B,H01L23/02@G,H05K1/14@G,H10W76/10@G,H10W76/63,H10W90/00,550
Stage: PROBLEM TO BE SOLVED: To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 22 made of a film as a base, and a conductive part 266 made of a conductor. The device 10 includes a sealed space 18. The sealed space 18 is surrounded by the first sealing member 20 and the second sealing member 30, and is blocked from the outside of the device 10. The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18. A first contact 48 of the first circuit member 40 and a second contact 58 of the second circuit member 50 are in contact with each other as being pressed against each other. The second circuit member 50 includes a connection electrode 59. The conductive part 266 is in contact with the connection electrode 59 inside the sealed space 18 and is exposed to the outside of the device 10.SELECTED DRAWING: Figure 5 (Grant)
Filing Date: Jan. 21, 2022
Publication Date: Oct. 18, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
