Japan Intellectual Property Rights: DIE BONDING FILM AND METHOD FOR MANUFACTURING THE SAME, DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Japan, Oct. 15 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'DIE BONDING FILM AND METHOD FOR MANUFACTURING THE SAME, DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-205889

Category (FI): H10P58/00@M,H01L21/52@E,H01L21/52@B,H01L21/78@M,H10W72/30@E,H10W72/30@B

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 22, 2022

Publication Date: July 4, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.