Japan, Jan. 15 -- TOKAI RIKA CO LTD has got intellectual property rights for 'ELECTRICAL COMPONENT ASSEMBLY AND SUBSTRATE.' Other related details are as follows:
Application Number: JP,2022-090769
Category (FI): B60H1/00,101@F,F24F11/89,G01K13/02
Stage: Grant (IP right document published.)
Filing Date: June 3, 2022
Publication Date: Dec. 14, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
