Japan, March 25 -- AESC JAPAN LTD has got intellectual property rights for 'ELECTRODE LEAD MEMBER, COVER ASSEMBLY, SECONDARY BATTERY, AND ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2023-206701
Category (FI): H01M50/148,H01M50/15,H01M50/176,H01M50/533,H01M50/534,H01M50/562,H01M50/566,H01M50/583,H01M50/586,H01M50/593
Stage: Grant (IP right document published.)
Filing Date: Dec. 7, 2023
Publication Date: March 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
