Japan Intellectual Property Rights: ELECTRONIC COMPONENT EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EQUIPPED SUBSTRATE

Japan, March 3 -- DAINIPPON PRINTING CO LTD has got intellectual property rights for 'ELECTRONIC COMPONENT EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EQUIPPED SUBSTRATE.' Other related details are as follows:

Application Number: JP,2024-169354

Category (FI): H01L23/12@N,H05K1/11@N,H05K3/46@B,H05K3/46@N,H05K3/46@Q,H10W70/00@K,H10W70/63,H10W70/685

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 27, 2024

Publication Date: Dec. 24, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.