Japan, June 10 -- YAZAKI CORP has got intellectual property rights for 'ELECTRONIC COMPONENT MODULE.' Other related details are as follows:
Application Number: JP,2022-130190
Category (FI): H02G3/16,H05K7/10@E,H01H85/50
Stage: Grant (IP right document published.)
Filing Date: Aug. 17, 2022
Publication Date: March 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
