Japan, March 5 -- SHINDENGEN ELECTRIC MFG CO LTD has got intellectual property rights for 'ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2022-049066
Category (FI): H05K5/06@D,H05K5/30,H05K5/10,H05K7/14@C,H05K5/00@B
Stage: PROBLEM TO BE SOLVED: To obtain an electronic device that reduces the amount of sealing resin used, reduces weight, and meets the requirements for vibration-proofing and waterproofing of a substrate.SOLUTION: A case member 10 of an electronic device 1 includes a partition wall 12 that partitions an internal space of the case member 10 into a first housing space S1 and a second housing space S2. A first substrate 30 is accommodated in a first housing space S1 with an annular first seal portion 40 sandwiched between the first substrate and one surface of the partition wall 12, a second substrate 32 is accommodated in a second housing space S2 with the annular second seal portion 42 sandwiched between the second substrate and the other surface of the partition wall 12, a first sealed space SX1 in which the sealing resin 50 does not enter is formed in the space between the partition wall 12 and the first substrate 30 surrounded by the first seal portion 40, and a second sealed space SX2 in which the sealing resin 50 does not enter is formed in a space between the partition wall 12 and the second substrate 32, which is surrounded by the second seal portion 42.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: March 24, 2022
Publication Date: Oct. 5, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
