Japan, June 10 -- TOKUYAMA CORP has got intellectual property rights for 'ETCHANT, PROCESSING METHOD OF SUBSTRATE, AND MANUFACTURING METHOD OF SILICON DEVICE.' Other related details are as follows:
Application Number: JP,2023-028399
Category (FI): H01L21/308@B,H10P50/64@A
Stage: Grant (IP right document published.)
Filing Date: Feb. 27, 2023
Publication Date: Sept. 6, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
