Japan, Aug. 6 -- APPLIED MATERIALS ISRAEL LTD has got intellectual property rights for 'EVALUATION ON CONTACT BETWEEN WAFER AND ELECTROSTATIC CHUCK.' Other related details are as follows:
Application Number: JP,2021-199022
Category (FI): H10P72/72,H01L21/68@R,H10P74/00@C,H01L21/66@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 8, 2021
Publication Date: June 20, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
