Japan, Jan. 20 -- ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC has got intellectual property rights for 'FORMULATIONS FOR HIGH POROSITY CHEMICAL MECHANICAL POLISHING PADS WITH HIGH HARDNESS AND CMP PADS MADE THEREWITH.' Other related details are as follows:
Application Number: JP,2022-006583
Category (FI): C08G18/10,H01L21/304,622@F,B24B37/24@C,H10P52/40,H10P52/00@D,C08G18/65,005,C08G18/00@F
Stage: Grant (IP right document published.)
Filing Date: Jan. 19, 2022
Publication Date: Aug. 2, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
