Japan, Oct. 21 -- DISCO CORP has got intellectual property rights for 'GRINDING METHOD FOR WAFER.' Other related details are as follows:
Application Number: JP,2022-102585
Category (FI): H10P52/00@C,H01L21/304,631,B24B7/04@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 27, 2022
Publication Date: Jan. 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
