Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'GRINDING METHOD.' Other related details are as follows:
Application Number: JP,2022-010701
Category (FI): B24B7/04@A,H10P52/00@C,H01L21/304,631
Stage: PROBLEM TO BE SOLVED: To provide a grinding method which does not require a considerably longer time in comparison with a conventional grinding method and in which an effective region that can be used for products can be maximally secured.SOLUTION: A grinding method which is applied in grinding a discoid work-piece which has a first surface and a second surface at the opposite side to the first surface when grinding it beginning from the second surface side, includes: a first grinding step of grinding the work-piece while bringing a first grinding stone into contact with the work-piece to form on the work-piece a discoid first thin plate part and an annular first thick plate part surrounding the first thin plate part; and a second grinding step of grinding the work-piece while bringing a second grinding stone into contact with the first thick plate part and the first thin plate part to form on the work-piece a discoid second thin plate part which is larger in diameter and thinner than the first thin plate part and an annular second thick plate part surrounding the second thin plate part, where in the second grinding step, the second grinding stone is brought into contact with a region on the second surface away by a width of the second grinding stone or more from an inner edge of the second surface remaining in the first thick plate part toward the outside.SELECTED DRAWING: Figure 6 (Grant)
Filing Date: Jan. 27, 2022
Publication Date: Aug. 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
