Japan, Jan. 15 -- DUPONT ELECTRONICS INC has got intellectual property rights for 'HEAT SINK FOR ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2021-122548
Category (FI): H01L23/36@M,H05K7/20@D,H10W40/25
Stage: Grant (IP right document published.)
Filing Date: July 27, 2021
Publication Date: Feb. 8, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
