Japan, Sept. 18 -- TOKYO ELECTRON LTD has got intellectual property rights for 'HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-077487
Category (FI): H01L21/31@C,H01L21/68@N,H01L21/324@K,H10P14/60,101@C,H10P72/70,H01L21/324@Q,H10P95/90,101@J,H10P95/90,101@Q
Stage: PROBLEM TO BE SOLVED: To improve in-plane heating uniformity of a substrate heated by a heating device that heats a substrate to be placed without increasing the thickness of the heating device.SOLUTION: A heating device heats a substrate that is directly placed or indirectly placed with another member therebetween, and has a linear heater, and a base material that is recessed toward the substrate from the opposite side of the substrate and has a groove therein to which the heater is fixed. The groove has a contact part in contact with the heater on a frontward side, and a non-contact part not in contact with the heater on a backward side.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: May 10, 2022
Publication Date: Nov. 22, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
