Japan, March 3 -- HPSP CO LTD has got intellectual property rights for 'HIGH PRESSURE SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows:
Application Number: JP,2025-029434
Category (FI): H10P95/90,101@G,H01L21/31@E,H01L21/324@G,F16J15/10@C,F16J15/10@T,H10P14/60,101@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 26, 2025
Publication Date: Sept. 9, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
