Japan, Feb. 24 -- TOWA CORP has got intellectual property rights for 'HOLDING MEMBER, CUTTING TABLE, CUTTING DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2023-121520
Category (FI): H10P72/78,H10P58/00@N,H01L21/78@N
Stage: PROBLEM TO BE SOLVED: To prevent a non-product portion that is generated by cutting a to-be-cut object from adhering to a holding member.SOLUTION: A holding member 10 sucks and holds a to-be-cut object W on a cutting table 4. On a surface of a contact area 10S that comes into contact with a non-product portion Wy that is generated by cutting the to-be-cut object W, multiple recesses 10c are formed. The multiple recesses 10c are connected to the outside of the contact area 10S.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: July 26, 2023
Publication Date: Feb. 6, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
