Japan Intellectual Property Rights: HOLDING MEMBER, TRANSFER DEVICE, CUTTING TABLE, CUTTING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, MANUFACTURING METHOD FOR HOLDING MEMBER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Japan, Feb. 24 -- TOWA CORP has got intellectual property rights for 'HOLDING MEMBER, TRANSFER DEVICE, CUTTING TABLE, CUTTING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, MANUFACTURING METHOD FOR HOLDING MEMBER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2023-121524

Category (FI): H01L21/68@P,H10P72/78

Stage: PROBLEM TO BE SOLVED: To make it possible to easily remove a to-be-held object after suction is released without damaging a holding member's suction power.SOLUTION: A holding member 10 has suction holes 10a formed for sucking and holding a to-be-held object W. Multiple recesses 10c are formed on the surface of a holding area 10R for holding the to-be-held object W by the suction holes 10a. A surface other than the multiple recesses 10c in the holding area 10R is a roughened surface 10d.SELECTED DRAWING: Figure 1 (Grant)

Filing Date: July 26, 2023

Publication Date: Feb. 6, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.