Japan, Sept. 30 -- DIC CORP has got intellectual property rights for 'INDAN RING-CONTAINING COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-104046
Category (FI): C08G61/12,C07C15/58,C07C211/43,C07C1/32,C07C209/68
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 28, 2022
Publication Date: June 23, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
