Japan, Jan. 20 -- SUMCO CORP has got intellectual property rights for 'JOINT SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2022-124375
Category (FI): H01L21/02@B
Stage: Grant (IP right document published.)
Filing Date: Aug. 3, 2022
Publication Date: Feb. 16, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
