Japan, July 14 -- NIPPON MEKTRON LTD has got intellectual property rights for 'JUNCTION PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING JUNCTION PRINTED WIRING BOARD.' Other related details are as follows:
Application Number: JP,2022-097427
Category (FI): H05K1/14@A,H05K3/36@A,H05K1/02@N
Stage: PROBLEM TO BE SOLVED: To provide a junction printed wiring board having a structure in which transmission characteristics are enhanced and a junction portion is space-saved.SOLUTION: A junction printed wiring board 1 includes a printed wiring board 10 having a signal line 11, a pair of ground lines 12 sandwiching the signal line 11 therebetween, and an insulating substrate 13, and a printed wiring board 20 having a signal line 21, a pair of ground lines 22 sandwiching the signal line 21 therebetween, and an insulating substrate 23. The signal line 11 is provided in the insulating substrate 13, and an end portion thereof is exposed at an exposed surface 14a of a portion where the insulating substrate 13 is locally thinned, and/or the signal line 21 is provided in the insulating substrate 23, and an end portion thereof is exposed at an exposed surface 24a of a portion where the insulating substrate 23 is locally thinned. The printed wiring board 10 and the printed wiring board 20 are joined together such that the end portion of the signal line 11 and the end portion of the signal line 21 face each other and are electrically connected to each other.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: June 16, 2022
Publication Date: Dec. 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
