Japan, Oct. 15 -- DIC CORP has got intellectual property rights for 'LAMINATE, PACKAGE, AND HEAT SEAL COMPOSITION.' Other related details are as follows:
Application Number: JP,2022-148874
Category (FI): B65D65/40@D,B32B27/30@A,B32B27/36
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 20, 2022
Publication Date: April 2, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
