Japan, March 5 -- TAIYO NIPPON SANSO CORP has got intellectual property rights for 'LAMINATION MOLDING METHOD.' Other related details are as follows:
Application Number: JP,2023-150468
Category (FI): B23K9/095,501@A,B23K9/04@Z,B23K9/04@G,B23K9/032
Stage: PROBLEM TO BE SOLVED: To provide a lamination molding method capable of uniformizing heights of weld beads without stopping molding.SOLUTION: A lamination molding method for laminating molten metal obtained by melting a metal wire 4a using an arc heat source, and molding a molded article 10 performs control to monitor a measured value of any one of current and a voltage of the arc heat source, and to change a command value of the other of the current and the voltage of the arc heat source, according to variations in the measured values.SELECTED DRAWING: Figure 6 (Grant)
Filing Date: Sept. 15, 2023
Publication Date: March 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
