Japan, March 3 -- ABLIC INC has got intellectual property rights for 'LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME.' Other related details are as follows:
Application Number: JP,2022-009825
Category (FI): H01L23/50@M,H01L23/50@U,H10W70/40,500@S,H10W70/40,500@U
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 26, 2022
Publication Date: Aug. 7, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
