Japan, March 23 -- ALPHA ASSEMBLY SOLUTIONS INC has got intellectual property rights for 'LEAD-FREE SOLDER COMPOSITION.' Other related details are as follows:
Application Number: JP,2023-178693
Category (FI): B23K35/26,310@A,C22C13/00,C22C13/02,H01L21/52@E,H10W72/30@E
Stage: Grant (IP right document published.)
Filing Date: Oct. 17, 2023
Publication Date: Jan. 23, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
