Japan, Jan. 21 -- SHOWA DENKO MATERIALS CO LTD has got intellectual property rights for 'LIQUID RESIN COMPOSITION FOR UNDERFILL, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2021-164795
Category (FI): H10W74/47,C08K3/013,H01L23/30@R,C08L63/00@C,C08L83/06,C08L83/10
Stage: Grant (IP right document published.)
Filing Date: Oct. 6, 2021
Publication Date: April 21, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
