Japan, Oct. 15 -- APPLIED MATERIALS INC has got intellectual property rights for 'LOW RESISTANCE AND HIGH RELIABILITY METALLIZATION MODULE.' Other related details are as follows:
Application Number: JP,2024-209308
Category (FI): H01L21/90@A,H10W20/44@X,H10W20/41@B,H10D64/01@A,H10D64/27@Z,H10D64/62@R,H10D64/60,H01L21/90@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 2, 2024
Publication Date: March 18, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
