Japan, Jan. 20 -- SHOWA DENKO MATERIALS CO LTD has got intellectual property rights for 'MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2021-019847
Category (FI): C08F2/44@C,C08F212/36,H05K1/03,610@N,C08F222/40,C08F236/14,H05K1/03,610@H,H05K1/03,610@J,C08J5/24,C08F287/00
Stage: Grant (IP right document published.)
Filing Date: Feb. 10, 2021
Publication Date: Aug. 23, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
