Japan, June 10 -- SHINKAWA LTD has got intellectual property rights for 'MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-113749
Category (FI): H01L21/60,301@G,H10W72/50@G,H10W72/50@L,H01L21/60,301@L
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 15, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
