Japan, Nov. 11 -- MIRISE TECHNOLOGIES CORP,DENSO CORP,TOYOTA MOTOR CORP has got intellectual property rights for 'MANUFACTURING EQUIPMENT OF SEMICONDUCTOR WAFERS.' Other related details are as follows:
Application Number: JP,2022-112727
Category (FI): H01L21/205,C23C16/52
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 13, 2022
Publication Date: Jan. 25, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
