Japan, Sept. 16 -- DISCO CORP has got intellectual property rights for 'MANUFACTURING METHOD FOR LAMINATED DEVICE CHIP.' Other related details are as follows:
Application Number: JP,2022-140484
Category (FI): H01L21/78@Q,H10P58/00@Q,H10W90/20@B,H01L25/08@B
Stage: PROBLEM TO BE SOLVED: To easily manufacture a laminated device chip including an extremely thin chip.SOLUTION: A manufacturing method for a laminated device chip includes preparing a first device wafer in which a plurality of first planned dividing lines are set on the surface and a first device is formed in each region partitioned by first scheduled dividing lines, a second device wafer in which a plurality of second planned dividing lines are set on the surface and second devices are formed in each area partitioned by the second scheduled dividing lines, and a support substrate, bonding the support substrate to the surface of the first device wafer, processing the first device wafer from the back side to be thinned to a predetermined thickness, cutting the first device wafer by forming a cutting groove along the first planned dividing line, attaching the first device wafer to the second device wafer, peeling off the support substrate from the first device wafer, and forming individual stacked device chips by dividing the second device wafer along the second planned dividing line.SELECTED DRAWING: Figure 6 (Grant)
Filing Date: Sept. 5, 2022
Publication Date: March 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
